Topics TADAM3D-µP – Summer School 2026

Interested?

Registration for our summer school, which takes place in Dresden from 14 to 25 September, opens on 16 March.
You will gain practical experience working on a project of your choice (see list) in small groups. First, we will guide you through the design process and provide mentoring support for your projects. Finally, during the project weeks in September, you will put your designs into practice. All of this takes place in the labs and on the various printers at TU Dresden.  
Contact us for more information!

1: “LED cube”

Goal: design and manufacture of LED cube with integrated wiring and LEDs using additive component embedding and ink-jet printing on flexible foldable substrate

2: “Soft Gripper”

Goal: design and manufacture of so-called soft grippers with nature/gecko inspired microstuctured surfaces using DMD/2PP-lithography, that allow to pick up delicate samples.

3: “Lab-on-a-chip – Part I – Microfluidic channel“

Goal: design and manufacture of microfluidic chip (microchannels: SLA, maskless lithography and PDMS imprinting). Cooperate with the second team in order to obtain one LOC device.

4: “Lab-on-a-chip – Part II – Nano-structures”

Goal: Design and manufacture functional nano-structures (2PP) for lab-on-a-chip application. Cooperate with the first team in order to obtain one LOC device.

5: “Printed PCBs”

Goal: design, fabrication, and characterization of FDM printed resistive and capacitive elements using conductive filaments, with particular emphasis on understanding the relationship between geometry, print parameters, and electrical performance.

6: “Printed elements for energy harvester”

Goal: design, fabrication, and characterization of 3DP energy harvester structures that convert kinetic energy into usable electrical energy using FDM or SLA/DLP processes.

Registration for the TADAM3D international summer school experience

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